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FS 090 Fused silica substrates 25.4 mm dia, 1 mm thick - used for telecommunications.
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Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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LBO crystals, Frequency conversion (SHG OF 1064nm TO 532nm in Y-Z plane)
7440-21-3
Silicon wafer (double side polished), <100>, Intrinsic, dia x thickness 150 mm x 625 µm
Laser Line Clean-Up Filters, Wavelength 785 nm
22398-80-7
Indium phosphide (single crystal substrate), (111)B ± 0.5o
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.