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Synonyms: Silicon substrate, single crystal, <100>, diam. × thickness in. 50.8 mm × 0.3 mm
Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
SSC 261 - Silicon wafer (single side polished), <100>, diam. × thickness in. 50.8 mm × 0.3 mm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Nd YLF laser rod (1%, a-cut, dia7*125mm, AR/AR@1053nm)
Dichroic mirror (for 1064/532 nm) Dia 38 mm, Thickness 6 mm
Silicon wafers, P-type, dia 4 inch, thick 0.525 mm [Thermal oxide wafer 100 nm SiO2 layer on Si (100)]
Fused Quartz substrates thick 1.5 mm, size 25.4 mm × 25.4 mm
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.