Enquiry

Silicon wafer (single side polished), <100>, diam. × thickness 50.8 mm × 0.3 mm

Code: SSC 261

Synonyms: Silicon substrate, single crystal, <100>, diam. × thickness in. 50.8 mm × 0.3 mm


PRIME

Si

9002

Double side polished

28.09

Bottle / Drum
18%

PRIME

Si

9002

Double side polished

28.09

Bottle / Drum

18%
PackingsPrice (INR)
1 pc 9603.00
10 pc 89019.00
Custom size POR
Packings
Enquire
Properties
2 inch (50.8 mm)

± 0.5 mm

300 μm

± 1%

<100>

±0.5 °

5 Å on front surface or better

Front side polished

≥ 1x107ohm-cm

5 x 105 or less

< 30 pm

Description

Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.

Application

SSC 261 - Silicon wafer (single side polished), <100>, diam. × thickness in. 50.8 mm × 0.3 mm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.

Safety Information

WGK Germany 2

Documentation

Certificate Of Analysis

(For eg. B 1615-0108)

Other Documents

For any quries, please write to us at

qc@ottokemi.com
Technical Services

Our team of R&D Experts and Scientists have expertise in all areas of research of Lab Chemicals, Nano Technology, Life Science, Custom Synthesis, Chromatography, and many others.

Enquire Now

DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received.
Not for medical, household or any other uses, for lab use only, Please test before use.


PackingsPrice (INR)
1 pc 9603.00
10 pc 89019.00
Custom size POR