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Specification Sheet
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Silicon sputtering target (with back plate), diam. x thickness 4 inch x 4 mm, 99.99%

: S 5716

: 7440-21-3

: Si

: 28.09

: Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.

: S 5716 (OTTO) Silicon sputtering target (with back plate), diam. x thickness 4 inch x 4 mm, 99.99% - used to produce a back reflector layer (made predominantly with aluminum) and front contacts (made with transparent conducting oxides, TCO).

Properties

: Materials science,Sputtering targets

: 99.99%

: Solid

: 4 inch

: ± 5%

: 4 mm

: ± 5%

Safety Information

WGK Germany 2

PackingsPrice (INR)
1 pc POR
Custom size POR
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