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Certificate of Analysis

Silicon sputtering target, diam. x thickness 4 inch x 4 mm, 99.99%

Code: S 3051

(For eg. B 1615-0108)

Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.

S 3051 Silicon sputtering target, diam. x thickness 4 inch x 4 mm, 99.99% - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.