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Silicon substrate, single side polished, <100>, P-type, contains boron as dopant, diam. × thickness 25 mm × 1 mm

Code: SS 126

Si

28046900

28.09

Bottle / Drum
18%

Si

28046900

28.09

Bottle / Drum

18%
PackingsPrice (INR)
1 pc POR
10 pc POR
100 pc POR
Packings
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Properties
<100>

± 0.5°

P-type

Boron as dopant

25 mm

± 5%

1 mm

± 5%

≤ 5 Å

Single side

Description

Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.

Application

SS 126 (OTTO) Silicon substrate, single side polished, <100>, P-type, contains boron as dopant, diam. × thickness 25 mm × 1 mm Cas7440-21-3 - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.

Safety Information

WGK Germany 2

Documentation

Certificate Of Analysis

(For eg. B 1615-0108)

Other Documents

For any quries, please write to us at

qc@ottokemi.com
Technical Services

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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received.
Not for medical, household or any other uses, for lab use only, Please test before use.


PackingsPrice (INR)
1 pc POR
10 pc POR
100 pc POR